IC Package Layout Engineer
Mobileye - Jerusalem, Israel
Still listed by Mobileye · checked 2 days ago · posted 8 Oct 2026 (6 days ago)
Skills: Package substrate layout, Advanced packaging, Signal integrity, Power integrity, PCB, Osat, RF
Mobileye develops purpose-built hardware and AI technologies that power advanced driver-assistance and autonomous-driving solutions. Our EyeQ™ SoCs and imaging radar technologies are designed to deliver scalable, automotive-grade performance and help enable safer mobility worldwide. Join our advanced packaging team and take ownership of package-substrate layout for cutting-edge digital and RF products. You will collaborate with silicon, package, SI/PI, PCB, manufacturing, and OSAT teams to deliver high-quality, manufacturable package layouts that meet demanding automotive requirements